IEEE IEMT 2026 invites researchers and industry professionals to submit their work to the 41st International Electronics Manufacturing Technology Conference, to be held at Le Méridien, Putrajaya, Malaysia.
This international conference is organized by the IEEE Electronic Packaging Society (EPS), Malaysia Chapter, with co-sponsorship from the IEEE Electronic Packaging Society (EPS). IEMT is a well-established global forum, typically attracting more than 400 participants worldwide. The most recent IEMT 2024, held in Penang, Malaysia, welcomed 600 attendees, featured 90 accepted papers, and delivered 16 interactive technical sessions.
IEMT 2026 welcomes paper submissions covering electronics packaging and manufacturing technologies across diverse semiconductor markets, including telecommunications, data centers, automotive and EV, healthcare, aerospace, defense, and related applications.
IEMT is also pleased to collaborate with Emerald Publishing (Microelectronics International) on a Special Issue titled “Advanced Interconnects, Packaging Materials and Reliability in Microelectronics” (https://www.emeraldgrouppublishing.com/calls-for-papers/advanced-interconnects-packaging-materials-and-reliability-microelectronics). Selected papers from the IEMT conference will be invited to submit extended full versions to this Special Issue, with all submissions undergoing full peer review. This initiative provides a strong pathway from conference presentation to journal publication, and guidance or coaching will be offered to interested authors, including via a webinar on 26th May 2026. We encourage researchers, academics, and industry participants to submit to IEMT and take advantage of this opportunity to further develop and publish their work.