For over four decades, the International Electronics Manufacturing Technology (IEMT) Conference has stood at the forefront of the electronics packaging industry. As technologies like Artificial Intelligence (AI), Edge Computing, and electric vehicles continue to scale exponentially, advanced semiconductor packaging has transformed into the primary driver of modern electronics innovation.

The 2026 edition zeroes in on the core manufacturing and integration complexities shaping tomorrow’s tech landscape. From chiplets and heterogeneous integration to the thermal management of high-power modules, the technical program provides actionable answers to the industry’s most challenging bottlenecks.

• Full Manuscript Submission is Opened, paper templates and guidelines are Available (See Author)
• Sponsorship registration is Opened (See Sponsors)
• Conference cost is Available and registration is Opened (See Registration)