39th International Electronics Manufacturing Technology (IEMT) Conference 2020

Venue: Le Méridien, Putrajaya, Malaysia

The International Electronics Manufacturing Technology (IEMT) Conference is the premier IEEE event devoted to the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems. IEMT is an established International conference of long standing organized by the Electronics Packaging Society (EPS) Society of IEEE. The 39th International Electronics Manufacturing Technology (IEMT) Conference 2020 is organised by the IEEE EPS Malaysia Chapter with co-sponsorship from IEEE Santa Clara Valley Chapter.

KEY Dates for Upcoming IEMT Conference 2020

1. Abstract Submission Due : 01st March 2020 → Extended to 15th March 2020 → 2nd extension to 31st March 2020
2. Abstract Acceptance Notification : 15th April 2020
3. Full Paper Submission : 31st May 2020
4. IEMT 2020 Conference : 28th-30th September 2020

Our Speakers

who will speak

Session 1:
HALF-Day

Prof Tan Chuan Seng
Nanyang Technological University, Singapore

3D Packaging & Integration

Session 1:
HALF-Day

Mr. Eduardo Pecolera
KNS, Singapore
Wire Bond Technology (Ball Bonding)

Mr. Ng Hein Fatt
KNS, Singapore
Wire Bond Technology (Wedge Bonding)

Session 2:
FULL-Day

Prof Fan Xuejun
Lamar University, USA

Reliability Mechanics and Modeling for IC Packaging – Theory, Implementation and Practice

Session 3:
FULL-Day

Dr Sia Choon Beng
FormFactor Inc, Singapore

Wafer and Chip Test

Session 4:
HALF-Day

Mr. Tan Chee Beng, Joe
ASM, Singapore
I4.0 & Automation: How to maximize the ROI

Mr. Jeroen Kleyburg
Besi, Netherland
Tooling Design and Predictive Maintenance For Robust Quality

Session 4:
HALF-Day

Mr. Mao Kuan Hsiang
NXP, Taiwan
Wafer Level Packaging for Automotive

Coming Soon

Coming Soon

IEMT 2020 Flyer

Contact Us

IEMT Secretariat

E-mail: iemtmalaysia@gmail.com

Organizing Companies & Institutions :

     

 

     
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